silicon chips

Designing silicon chips to mimic human organs sounds fanciful.

设计硅芯片模仿人的器官听上去是异想天开。

Even the most optimistic semiconductor3) researchers say that silicon － based computer chips may only have 15 years or so left in them.

即便最乐观的半导体研究者都说，以硅为原料的计算机芯片或许最多还能存在15年左右。

The application of cutting brittle material such as ceramic, silicon chips and glass by laser has attracted more attention folling the deepened research of cutting by laser induced stress using controlled fracture technique.

随着激光诱导热应力控制断裂法分离脆性材料研究的深入，应用该方法切割陶瓷、硅片、玻璃等脆性材料得到了较多关注。

Most electronic components use silicon chips these days.

现在多数电子元件都用到硅片.

In this technology, silicon chips are mounted onto a silicon substrate by a flipchip technique.

此技术采用倒装片技术把硅芯片安装到硅基板上。

The silicon chips are less than a millimetre thick.

这些硅片厚度不足一毫米。

The control accuracy, robustness and stableness of temperature systems are crucial to improve the weld quality and reliability of silicon chips.

温控系统的控制精度、鲁棒性、稳定性，对提高硅片的焊接质量和可靠性至关重要。

Polysilicon, used to make silicon chips and photovoltaic ( solar) cells, is in short supply because of the voracious demand of the booming semi-conductor industry and the rapidly expanding solar sector.

多晶硅被用于制造硅片和光伏（太阳能）电池。由于日益兴旺的半导体行业与高速增长的太阳能行业的大量需求，多晶硅供不应求。

The silicon chips are usually designed as membranes, which have limited sensitivity.

以往的硅生化传感器多设计为膜片式，器件的灵敏度受到限制。

Compared with the traditional silicon chips, polymer ones have the advantages of easily fabrication, stable properties and low cost, and so on.

与传统的硅材质芯片相比，高聚物材料芯片具有易于加工，性质稳定以及成本低廉等众多优点，所以近年来高聚物芯片的制作和应用成为了微流控芯片技术的发展方向。

For efficiently cooling electronic components, the flow boiling heat transfer performance of FC-72 on micro-pin-finned silicon chips were studied.

为了提高电子器件的冷却效率，研究了不导电介质FC-72在表面加工有方柱微结构的模拟芯片上的流动沸腾强化换热性能。

Minicomputers mounted on tiny silicon chips.

装在细小硅芯片上的微型计算器。

Boundary-scan Test ( BST), as one of Design For Testability ( DFT) technology that inserts DFT into silicon chips, supports test at all hierarchy level.

边缘扫描测试技术就是一种将可测性直接设计到硅片里的技术，支持系统级、板级、芯片级等所有层级的测试。

Existing ways of printing devices at the nanoscale tend to be complex and expensive, and more appropriate for making silicon chips.

以纳米技术领域的打印设备的现有方式来制作硅片往往是复杂与昂贵的，而且更为合适。

The silicon chips are less than a millimeter thick.

这些硅片厚度不足一毫米.

But it takes years for the companies that make the silicon chips to overhaul their strategies.

但是硅片制造公司耗费数年时间来检查其策略。

A vast network of computers is being harnessed to design components for the next generation of silicon chips.

一组电脑搭建的巨大网路被用来设计下一代硅片的组件。

While incandescents generate heat to produce light, LEDs create it from the movements of electrons on silicon chips.

白炽灯泡通过生热发光，LED则通过硅片上的电子运动发光。

THE SE days using silicon chips to allow machines to see is commonplace.

把硅芯片应用到计算机上看得到东西现在已经司空见惯.

most are produced in huge, ultra-clean factories using batch processes similar to those for making silicon chips.

大部分是在巨大的，超净的工厂中采用类似于生产硅片的工艺来分批制成的。

For the silicone polyester ( SP) coating added different fillers, the surface charge's polarity and quantity were measured after contacting with n and p type silicon chips, which have been oxygenized and passivated, the contact charge sequence can be obtained.

对加入不同填料的聚酯改性硅漆（SP），测量其与表面氧化和表面钝化的n型和p型硅片接触后表面带电极性和带电量，得出一个接触带电序列。

Structural Evolvement of Proton-Impregnated Monocrystal Silicon Chips

质子注入单晶硅中的结构演化

By finding collinear points at edge of silicon chips and using straight line fitting method, the angle can be calculated.

该算法通过提取芯片边缘点的坐标点集和拟合直线参数来计算芯片的角度。

In the past four years, 70 per cent of Sony's investment has been in silicon chips.

在过去的四年中, 硅片占索尼投资额的70%.

For efficiently cooling electronic components, experiments were conducted to study the pool boiling heat transfer performance of FC-72 over silicon chips with surface microstructures.

针对电子器件的高效冷却问题，对表面加工有微结构的硅片上FC-72的池沸腾换热性能进行了实验研究。

The purpose of this thesis is based on optical scanning systems to probe the inner structures of silicon IC chips by compendious and valid methods.

本论文是以光学扫瞄系统为基础，针对矽晶片内部的结构成像设计出有效方便的架构。

Prof Hopper's research involved developing silicon chips for the Cambridge Ring, an early form of computer networking.

霍珀教授的研究内容，包括为早期的计算机网络&剑桥环（Cambridge Ring）开发芯片。